December 2015 (published: 10.12.2015)
Number 4(20)
Home > Issue > On the formation of the gradient temperature fields in the spark plasma sintering process
Lev P. Bulat, Novotelnova Anna V. , Tukmakova A.S. , Yerezhep D.E. , Oprya К.А.
The computer simulation of the spark plasma sintering process (SPS process) has been carried out. The simultaneous impact of thermal and electrical fields was considered. The capability of creating of the gradient temperature field during the SPS process has been studied. Factors having impact on temperature field distribution have been analyzed. Contact between die and lower graphite insert leads to gradient temperature field formation. The reason is inhomogeneous thermal field distribution, a large part of which goes in the direction of the contact. The change of die configuration, namely, the increasing of foundation size, leads to changes in thermal fields distribution and temperature difference as a result. Greater values of the distribution between lower (cool) and upper (hot) interfaces of the sample can be obtained when using rectangular shape of die foundation. The height dependence of temperature difference has been showed.
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Keywords: Spark plasma sintering, thermoelectrics, nanostructures, computer simulation, figure of merit, thermal conductivity, thermal and electrical fields, die, gradient temperature field, thermoelectric converters, thermoelectric coolers.
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License
UDC 621.362; 621.315.562
On the formation of the gradient temperature fields in the spark plasma sintering process
The computer simulation of the spark plasma sintering process (SPS process) has been carried out. The simultaneous impact of thermal and electrical fields was considered. The capability of creating of the gradient temperature field during the SPS process has been studied. Factors having impact on temperature field distribution have been analyzed. Contact between die and lower graphite insert leads to gradient temperature field formation. The reason is inhomogeneous thermal field distribution, a large part of which goes in the direction of the contact. The change of die configuration, namely, the increasing of foundation size, leads to changes in thermal fields distribution and temperature difference as a result. Greater values of the distribution between lower (cool) and upper (hot) interfaces of the sample can be obtained when using rectangular shape of die foundation. The height dependence of temperature difference has been showed.
Read the full article
Keywords: Spark plasma sintering, thermoelectrics, nanostructures, computer simulation, figure of merit, thermal conductivity, thermal and electrical fields, die, gradient temperature field, thermoelectric converters, thermoelectric coolers.